Backside Illumination (BSI) is an imaging technology that is used to decrease pixel size for higher resolutions in imaging devices without sacrificing image clarity or quality and performance.
BSI takes each pixel’s silicon light sensor to the “back” side of the silicon wafer, thereby getting most of the light instead of it being scattered by the layers on the front side of the silicon wafer before reaching the sensor. This technology has enabled companies like
Sony and OmniVision, to develop 5MP or 8MP cameras, to bring sharper and clearer images to their consumers without having to increase the size of the mobile phone or digital camera.
Toshiba has taken a huge leap further than OmniVision or Sony in providing high resolutions for imaging devices. In late October 2009, Toshiba announced that it has developed a new CMOS image sensor using BSI technology to bring 14.6 million pixels to devices such as digital still cameras and mobile phones with video imaging.
The new sensor will be sampled in December 2009, and mass production of these BSI sensors will follow beginning the third quarter of 2010. This will enable Toshiba to offer better images in its line of mobile phones, and break into the digital camera market with a bang.
Toshiba’s new CMOS image sensor will shrink pixel size to 1.4 microns, thus enabling 14.6 million of these pixels into a 1/2.3 inch sensor. Consumers are demanding better, sharper and clearer images from their digital cameras or mobile phones.
Toshiba will be able to bring that and more to its existing products and its new line of digital cameras.